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Packaging Design Engineer

AMD Maquinaria
Hyderabad, India

Skills:

Shell, PERL, Python, Tcl, Cadence Tools, 3D package electrical modeling tools, SIP PCB Editor, Valor, Dfm, SerDes design, DFR, Calibre, Mentor Xpedition design tools

Early Applicant

Packaging Design Engineer

Xilinx
X
Hyderabad, India

Skills:

Tcl, Python, PERL, Shell, SIP PCB Editor, SerDes design, Valor, Cadence Advanced Package Designer, Cadence Tools, Calibre, Mentor Xpedition design tools, 2D 3D package electrical modeling tools

Early Applicant

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE)

Micron Technology
Hyderabad, India

Skills:

power integrity , Python, Tcl, Mentor Calibre, DFT structures, Innovus, Signal Integrity, Synopsys IC Compiler, TSV design, layout automation scripting, Cadence Virtuoso, thermal considerations

Early Applicant
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