test equipment , design of experiments, OSA assembly, Digital Circuits, module manufacturing processes, optical transceivers, device characterization, failure analysis techniques, Schematics, device physics, Data Analysis, PCBA, fault isolation techniques

Quality Systems, WSH practices, Fmea, Manufacturing concepts, Semiconductor failure modes, Failure Analysis, Reliability

Java, Machine Learning, Usb, Linux Shell Scripting, Jtag, Pcie, Perl, Python, silicon debug, Server platform, Linux proficiency, Ai, ATE test class method, PC systems, Advantest 93k platform, Failure Analysis, computing hardware, high bandwidth memory, Customer Reference Board, PCB board

Data Analytics, AI machine learning, NAND DRAM HBM devices, Fab processes, electrical device characterization, fault isolation equipment, physical failure analysis

manufacturing processes , Semiconductor structures and manufacturing, DC measurements, Fmea, Frequency generators, Oscilloscopes, Test time reduction activities, Fab transfers, Electrical Analysis, Semiconductor physics failure mechanisms, Fab process qualifications, FTA, Fishbone Analysis, 8-D Methodology, Statistical Yield Analysis, Electrical measurement methods, Doe, Is Is-not and Why-Why, FE and BE yield improvements, Microcontroller programming with C, SBL

fib, CSAM, FA techniques, cross-section ion-mill, Adhesion test, Ftir, Material characterisation procedures, EDX, Reliability Environmental Stress Test Requirement

Data Analytics, Machine Learning, HBM, Fab processes, Ai, fault isolation equipment techniques, electrical device characterization, DRAM, physical failure analysis, NAND

reliability test , uHAST, PCT, Sat, MSL, hts, cross-section, Chemical Decap, Failure Analysis, Tc, ion-mill, HAST, JEDEC Reliability Test Requirement, EDX, Sem

Java, Python, analytic tools such as JMP, AI ML programs, data analysis programs, HDD failure analysis