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Advanced Packaging Technology Development (APTD) at Micron Technology, Inc. is hiring a Process Simulation Engineer with strong technical expertise. The role involves process and equipment simulations for advanced semiconductor packaging, including HBM products, focusing on all aspects of packaging technology and their interactions. Collaboration with design, characterization, assembly R&D, and process teams is required.

Responsibilities

Partner with process engineering teams to understand semiconductor packaging processes and develop robust FEA, solid & flow simulations, and analytical simulation models.
Guide test vehicle development to improve simulation correlation with empirical data; develop test plans as needed to verify models and validate analysis approaches against test outcomes.
Participate in the development and advancement of simulation modeling methodologies across structural, thermo‑structural, flow, thermal, and other multiphysics domains.
Perform structural, thermal, and flow simulations for semiconductor packaging processes to predict behavior, assess risks, and enhance process and product performance.
Provide process and equipment simulation reports to support pathfinding, technology development, and product introduction.
Communicate FEA and flow simulation results (preferably demonstrating CFD) analysis results clearly to process engineers, providing actionable technical insights, design recommendations, and risk assessments.
Mentor and mature interpersonal analysis capability across structural, thermal, and flow technology domains.

Requirements

Strong informative background or hands‑on experience in proven mechanics, finite element methods (FEA) with expertise in multiphysics modeling and simulation. Good understandings of fluid mechanics, thermodynamics, heat & mass transfer, kinetics, computational fluid dynamics (CFD) would be useful.
Proven ability to understand and model multiphysics interactions, including setting up integrated multiphysics frameworks for analysis, measurements, and validation in IC packaging and related areas.
Proven foundation in mechanics, physics, and chemistry, with emphasis on both analytical methods and measurement techniques.
Extensive experience with high‑fidelity FEA including static, multifaceted, thermal, flow, and coupled multiphysics analyses.
Experience in static/ dynamic/ thermal analysis and multi-physics modeling with ability to handle convergence issues due to large deformations, large strains, plasticity, creep, viscoplasticity, viscoelasticty and contact.
In‑depth knowledge of material properties, material characterization techniques, fatigue life prediction, creep damage assessment, and measurement methods relevant to IC packaging.
Proficiency in commercial simulation tools such as, Ansys Mechanical, APDL, ACT, DesignModeler, and SpaceClaim with experience in CAD tools (AutoCAD, SolidWorks). Knowledge of working with Ansys Fluent or Star‑CCM+ would be beneficial.
Strong understanding of semiconductor packaging processes, materials, and technology trends, including but not limited to dicing, backgrinding, die attach, PECVD, cryogenic cleaning, organic substrates, over‑molding materials, wire‑bonding, and C4 / Cu pillar attachment methods.
Ability to understand failure mechanisms and develop both analytical and FE‑based models to explain and predict failure modes.
Experience in defining and driving numerical and/or laboratory experiments to evaluate feasibility and validate concepts and solutions for new package technology development.
Strong inclination toward demonstrating AI/ML techniques to reduce simulation iterations, accelerate convergence, and improve modeling efficiency.
Ability to turn simulation outcomes into scalable, easy‑to‑use tools or workflows for broader engineering adoption.
Excellent oral and written communication skills, with the ability to collaborate optimally in multi-functional, multidisciplinary team environments.

Educational Qualification

MS/M.Tech with 6 Years or PhD with 1 to 2 years experience
Mechanical Engineering, Materials Engineering, Physics, or related field

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

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Senior/Staff Engineer Process Simulations APTD