process flow , yield enhancement, Root Cause Analysis, Fmea, Spc, process integration, DRAM, 8D, Failure Analysis, NAND

verigy 93k , data analysis tools, UFLEX, statistical methods

statistical data analysis , lithography tooling, project management, photolithography process, Fmea, Spc, Doe, cost yield improvement, Camline, process transfer, Jmp

3d packaging , Si Photonics based packaging design, wafer level packaging process flow, CST, statistical analysis tools, PowerSI, hybrid multi-chip integration, Momentum, SI-Wave, IE3D, hfss