Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India's first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.

Integration responsibilities for RF-CMOS and RF-SOI technologies
Add features (active devices and passives) to existing technologies and create new technologies that will improve performance and extend application range
Responsibilities may extend to leading Wide Band Gap RF technologies
Design and Layout of test chips to aid in device/technology optimization, rel assessment and SPICE model extraction
End to end Project Management from initial project justification to final qualification and yield ramp with responsibilities for achieving desired performance, quality/yield, schedule and cost targets.
Work with Design enablement team and CAD partners to enable a user friendly PDK with well characterized tool box
Select and interact with university, research lab and commercial entities to drive a world class roadmap
Build and lead a cross functional team across diverse geographies
Build strong customer relationships based on confidence in TEPL technical capabilities
Competitor benchmarking; ownership of technology roadmap
Presentation to internal and customer senior executives
Travel (few weeks per quarter)

Essential Attributes:

Ability to manage, mentor, and lead a team of highly motivated professionals.
Able to work independently, self-motivated with a strong drive to win.
Team player with the ability to work across diverse cross-functional teams spread across the world.
Leadership skills to influence all levels of the organization.
You're inclusive, adapting your style to the situation and diverse global norms of our people.
An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
You're collaborative, building relationships, humbly offering support and openly welcoming approaches.
Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Qualifications:

M.S or PhD in Electrical Engineering, Physics or equivalent
Strong understanding of CMOS (including SOI), SiGe BICMOS and RF power devices and technology integration
Deep knowledge of RF technology parameters and figures of merit (RonCoff, 1/f noise, linearity, etc); experience in achieving competitive performance
Proven track record in delivering these technologies into volume manufacturing
Deep understanding of how integration features impact technology performance and costs (eg. air gaps, sidewall spacers, capacitors, inductors, 3D integration)
Able to work with designers, modelling team and customers to design and characterize basic circuits (LNA's, switches, PA's, etc) and circuit elements / devices
Has delivered similar technologies previously
Track record of publications and patents
Understanding of key modules especially as they pertain to RF technologies (eg. Epi, Implant, BEOL, heterogeneous integration)
Understanding of RF front end module trends and existing/emerging RF standards with impact on technology requirements
Ability to lead cross-functional teams and achieve project completion within timeline and cost targets
Ability to work across different cultures and geographies
Good team player
Innovation and competitive mindset

Desired Experience Level:

15+ years experience in the semiconductor industry
Proven track record of successfully developing new technologies into high volume production
Proven problem solving skills using design of experiments and analytical tools

Sr. Director/Head of RF Technologies (Integration - RF-CMOS and RF-SOI technologies)