Overview

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's Intelligent Cloud mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission. The Data Processing Unit (DPU) team brings together state-of-the-art software and hardware expertise to create a highly programmable and high-performance ASIC with the capability to efficiently handle large data streams. Thanks to its integrated design, this solution empowers teams to operate with increased agility and deliver significantly superior performance compared to CPU-based alternatives Central to our mission is development of platforms for Azure Datacenters based on our highly programmable data processing chip (DPU). As a Thermal Design Engineer, you will be responsible for the design & development of a highly efficient / cost optimized cooling solution for all the servers and pluggable IO cards.

Responsibilities

Perform thermal simulation & validation of highly dense cards and servers involving power hungry SOCs, Optics & Solid-State Drives - Work with hardware design & mechanical engineers to develop an effective/ cost optimized cooling solution - Work with the ODMs to define the thermal validation test plan following the Microsoft standards, execute and generate the test reports - Develop 2D thermal model for the in-house developed ASICs using the raw models of various blocks from respective IP vendors - Provide inputs on in-house developed ASIC thermal specification and thermal design guidelines to tech pubs for preparation of datasheet & HW user manual

Qualifications

Required/Minimum Qualifications - 8+ years of related technical engineering experience - OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience - OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience - Deep understanding of heat transfer, fluid mechanics and CFD - Good working experience on any telecom Products, CPU & GPU Servers - In-depth knowledge of heatsinks, TIM, Fans & Chassis mechanicals - Working knowledge on the specification and application of all types of heat sinks like copper (with embedded heat pipe) and vapor chamber - Proficient with FlothermXT, Flotherm, Icepak, SolidWorks, Pro-E Additional or Preferred Qualifications - 11+ years technical engineering experience - OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience - OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience - Working knowledge on 1RU/ 2RU liquid cooled server designs - Working knowledge on defining dynamic fan control algorithms using component temperature thresholds - Working knowledge on RDT, HALT, RVI and Acoustics Testing Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form. Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

Mechanical Design Engineer

Lead Mechanical HVAC Design Engineer – Data Centers

Mechanical Design Engineer

Sr. Thermal Design Engineer

Mechanical Design Engineer (Transformer)

Electromechanical Design Engineer