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Skills:
semiconductor packaging , Ms Office, automation, Statistical Analysis, discrete device testing, Fmea, Spc, Npi, engineering databases, Jmp, Power Electronics, APQP, Semiconductor Manufacturing, wafer level processing, yield engineering, design review processes, assembly and test methods
Skills:
Reliability tests and methods, Reliability Engineering, GaN HEMT devices technology, Fmea, Wide Bandgap Technologies, Product Qualification, JEDEC, quality engineering, Failure Analysis, AECQ, 8D
