STAFF R&D/PRODUCT DVL ENGINEER

Job Overview

As a Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry-targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success.

KEY RESPONSBILITIES

• 10+ years of relevant work experience in electrical design, RF design, or PCB design
  . Subject matter expert in signal integrity design, simulation and validation activities through product development cycles
  . Establishing signal integrity design performance/functional requirements for new products
  . Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
  . Performing PCB design schematic and layout reviews
  . Creating actionable recommendations based upon design reviews and simulation results
  . Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement
  . Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools), with hands-on experience in ADS circuit simulation, channel analysis, and optimization flow for high-speed interconnects.
  . Experienced with IBIS-AMI model simulation for SERDES channel performance evaluation, including parameter tuning, equalization analysis, and BER/eye diagram verification.
  . Solid understanding of electromagnetic theory and electrical circuit behavior, with practical experience in active component design such as DSPs, re-timers, and re-drivers for high-speed signal transmission.
  . Knowledgeable in eye diagram optimization and adaptation parameters (e.g., CTLE, DFE, FFE, emphasis settings) for link margin improvement.
  . Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problems.
  . Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers.
  . Ability to work in a global environment - able to accommodate varying time zones and capable of collaborating with individuals across geographies.
  . Highly motivated, quick learner, and able to work independently.

DESIRED SKILLS:

Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system
. Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end, or similar systems)
. Hands-on experience with optical transceiver or optical module design, including integration of electrical and optical interfaces for high-speed data transmission.
. Familiarity with high-speed SerDes signal processing, including equalization, clock recovery, and channel adaptation techniques.
. Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English
. Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction
. Six Sigma methodologies or other strong data analytics background
. Printed circuit board design, fabrication and assembly (Altium, AutoCAD)
. Experience in project leadership, especially as it applies across design, development, and manufacturing teams
. Test equipment (oscilloscope, vector network analyzer, BERT)
. Signal conditioning techniques (equalization, amplification)
. Direct customer design and support experience
. Application and test knowledge of high-speed devices and equalization techniques

What your background should look like

Generally requires Bachelors degree in appropriate field with a minimum of 8 years of experience Masters degree or higher or local equivalent may be preferred at this level

Competencies