Company

Qualcomm India Private Limited

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

We are looking for an experienced Principal Engineer –RV(EM/IR) to lead power integrity and reliability signoff activities for advanced-node SoC designs. In this role, you will drive IR drop and electromigration (EM) analysis, define signoff methodologies, and collaborate with cross-functional teams to achieve robust and reliable silicon implementation. The ideal candidate should possess deep expertise in power integrity analysis, a strong understanding of advanced-node challenges, and proven experience in leading signoff closure for complex chip designs.

WhatYou'llDo

Lead full-chip and block-level IR drop and electromigration (EM) analysis for advanced-node SoC designs
Drive power integrity signoff closure by identifying, debugging, and resolving IR/EM violations
Collaborate with Physical Design, Power, Package, and Foundry teams to optimize power delivery networks
Define and improve EM/IR methodologies, automation flows, and signoff strategies
Perform static and dynamic IR analysis across multiple operating conditions and scenarios
Analyze power grid robustness, current density, and thermal impacts to ensure design reliability
Support tapeout activities and ensure high-quality signoff delivery within project timelines

WhatWe'reLooking For

Bachelor's or Master's degree in Electronics, Electrical Engineering, or VLSI-related discipline
10+ years of experience in IR/EM analysis, power integrity, or Physical Design signoff
Strong understanding of power integrity concepts including static/dynamic IR drop, EM analysis, and power grid optimization
Hands-on experience with industry-standard tools such as Cadence Voltus, Ansys RedHawk, or equivalent
Good understanding of Physical Design flow including floorplanning, placement, CTS, routing, and extraction
Strong scripting skills in Tcl, Python, Perl, or Shell for automation and flow development

Good to Have

Experience with advanced technology nodes such as 7nm, 5nm, 3nm, or below
Exposure to package-aware analysis, thermal analysis, and low-power methodologies
Experience in leading signoff closure for large-scale SoC or high-performance compute designs

Success in This Role Looks Like

Achieving robust IR/EM signoff with minimal iterations and successful tapeout execution
Early identification and resolution of power integrity risks impacting performance and reliability
Improved signoff productivity through methodology enhancements and automation initiatives
Strong technical leadership and collaboration across implementation and signoff teams

Location

On-site – Bengaluru

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If you would like more information about this role, please contact Qualcomm Careers.

Principal Engineer RV (EM/IR)